The PlayStation 5 Slim is about to debut, and just as its aesthetic changes have been a topic of discussion, the same will likely happen with what's inside. Shortly before the release of this new model that will eventually replace previous versions in the market, there are already videos showing everything it contains, revealing the modifications compared to its predecessors.
Youtubers dissect the PS5 Slim and reveal its internals
The PS5 Slim is already the subject of the famous "Teardown" videos, allowing fans and interested individuals to see the model in real images and all the changes it presents. Videos by YouTubers like Dave2D and Linus Tech Tips have sparked debates. The first point that has generated discussion among fans is the decision to cover the console with 4 panels, with 2 of them having a glossy finish, which is known to be susceptible to smudges and scratches.
What are the internal differences between the PS5 Slim and the regular PS5?
The first surprise comes with how easy it is to disassemble the Blu-ray drive unit in the standard model because it has a direct connection to the motherboard, reaffirming that this unit will be related to the motherboard for online validation, generating a digital signature that maintains security and legality of use between both parts of the console.
Additionally, the PS5 Slim features a new 19-blade fan manufactured by Foxconn, along with a redesigned heat dissipation system. According to the initial tests, performed without an update, the PS5 Slim reported temperatures between 60 and 63 degrees, similar to those of the standard model. According to initial interpretations, this would be a significant achievement for Sony's engineering team, as it manages to keep the temperature at standard levels for the Fat models within a compact and smaller system.
As for the SoC (System on Chip), it is reported that Sony opted for the 6nm version manufactured by TSMC, making it the same SoC as the model released in 2022. A report from TweakTown recalls that the 6nm process is more favorable for Sony, allowing them to get more CPU per wafer, optimizing the process and aligning it with their goal of distributing 25 million units by March 2024.
Regarding the specific cooling of the SoC, liquid metal is once again the choice, as previously anticipated. Any modification in this regard would have significantly affected the console's manufacturing and distribution processes, something Sony wants to avoid at this time.
Finally, there are reported changes in the position of the soldered chips on the motherboard, which is related to the redesign of the heat dissipation system. Moreover, the PS5 Slim no longer has ventilation grilles on the curves. Also, the front panel only displays 2 USB-C ports in the front, while the rest is located at the back, so there is no reduction in this aspect.
What are your thoughts on the contents of the PS5 Slim's interior?
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